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Specilize in Water Treatment & Disinfection Technology
8 Years
| Ask Lasest Price | |
| Brand Name : | Geemblue |
| Model Number : | XFDM02 |
| Certification : | ISO9001 CE |
| Price : | NEGOTIATION |
| Payment Terms : | L/C, T/T, Western Union |
| Supply Ability : | 10 SET/MONTH |
| Delivery Time : | 60-80 work days |
Equipment For Regenerating Sodium Persulfate And Recovering Copper From Microetching Waste Solution Using Diamond Anode Plate
Microetching is a pretreatment process in production processes such as copper plating of the circuit board, pattern plating and OSP. It involves the use of various systems such as sodium persulfate/sulfuric acid or ammonium persulfate/sulfuric acid or hydrogen peroxide/sulfuric acid. The purpose of microetching is to roughen the copper surface to enhance adhesion with the plating layer. The function of sodium persulfate, ammonium persulfate and hydrogen peroxide is to increase the oxidation value of sulfuric acid solution and achieve the effect of rapid copper etching. The equipment utilizes electrolysis with diamond anode plates for regenerat- ing sodium persulfate and recovering copper from the microetching waste solution. For microetching waste solution of sodium persulfate/sulfuric acid system, it effectively leverages the characteristics of diamond's highest oxygen evolution potential and most negative hydrogen evolution potential, and utilizes a special ion-exchange membrane frame as the anode frame to efficiently regenerate sodium sulfate into sodium persulfate in the anode area. Copper ions in the cathode area are reduced to elemental copper. The concentration of copper ions in the regenerated microetching solution treated by this process can be less than 0.5g/L, and the concentration of sodium persulfate can reach more than 80g/L. The solution can be stably reused in the microetching tank for production without affecting the quality of microetching.
Specifications:
| Equipment model | XFDM01B | XFDM02B | XFDM04B |
| Equipment dimension (L×W×H, mm) | 1497 x 1234 x 1897 | 1392 x 1247 x 2048 | 2172 x 1764 x 2666 |
| Operating weight of equipment(kg) | 1275 | 1997 | 1867 |
| Number of modules | 1-slot 2-module | 2-slot 4-module | 4-slot 8-module |
| Anode material | BDD | ||
| Cathode material | Ti | ||
| Area of anode strip(㎡) | 0.88 | 1.75 | 3.5 |
| Treatment capacity(m³/h) | By water quality | ||
| Single-batch processing time(h) | By water quality | ||
| Design circulating flow(m³/h) | 10 | 20 | 30 |
| Head loss at design circulating flow(KPa) | 20 | 20 | 40 |
| Installed power(Kw) | 10 | 20 | 36 |
| Service power(Kw) | ≤7 | ≤12 | ≤26 |
| Current density(mA/c㎡) | ≤70(≤301 A) | ≤70(≤602 A) | ≤70(≤1204 A) |
| Maximum heating power(Kw) | 2.79 | 5.6 | 11.2 |
| Input voltage | AC 380 V/50 Hz | AC 380 V/50 Hz | AC 380 V/50 Hz |
| Power output | DC 500 A/20 V | DC 1000 A/20 V | DC 500 A/72 V |
| Operating ambient temperature | 0 ℃ ~ 40 ℃ | ||
| Relative humidity | ≤90% | ||
| Installation method | Indoor | ||
| Circulating water pump | 40 FPZ-18 | TG - 40032 | TG - 50052 |
| Filter | Bag type 50 μm | ||
| Pressure protection | √ | ||
| Temperature protection | √ | ||
| Inlet diameter | DN50 flange | DN50 flange | DN65 flange |
| Outlet diameter | DN50 flange | DN50 flange | DN65 flange |
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